High-frequency signal transmission line and electronic device

ABSTRACT

A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a high-frequency signal transmission line and an electronic device, and more specifically relates to a high-frequency signal transmission line and an electronic device, in each of which a signal line is provided in a body including laminated insulator layers.

2. Description of the Related Art

As a high-frequency signal transmission line of the related art, a microstrip flexible substrate connection line has been known that is described in, for example, Japanese Unexamined Patent Application Publication No. 9-139610. In the microstrip flexible substrate connection line, microstrip lines are formed with sandwiching therebetween a thin flexible dielectric substrate. Such a microstrip flexible substrate connection line is thinner than a coaxial cable. Therefore, it is easy to dispose the microstrip flexible substrate connection line in a narrow space within a wireless communication terminal.

Incidentally, in a case where circuit substrates are connected to each other using the microstrip flexible substrate connection line described in Japanese Unexamined Patent Application Publication No. 9-139610, it may be considered that a coaxial connector receptacle described in, for example, Japanese Patent No. 3161281 is used. Specifically, the coaxial connector receptacle is mounted on one end of the microstrip flexible substrate connection line. In addition, the coaxial connector receptacle is attached to a coaxial connector plug provided in a circuit substrate, and hence, the microstrip flexible substrate connection line is connected to the circuit substrate. As a result, it becomes possible to easily connect the microstrip flexible substrate connection line to the circuit substrate.

However, in a case where the coaxial connector receptacle is applied to the microstrip flexible substrate connection line, there is a possibility that the characteristic impedance of a signal line is mismatched with respect to a predetermined characteristic impedance (for example, 50Ω). In more detail, the coaxial connector receptacle is configured by a plurality of parts. Therefore, stray capacitance or parasitic inductance easily occurs in the coaxial connector receptacle, and the characteristic impedance of the coaxial connector receptacle is easily mismatched with respect to the predetermined characteristic impedance. Furthermore, there is a possibility that coaxial connector receptacles having various structures are mounted on the microstrip flexible substrate connection line. Therefore, there is a possibility that a characteristic impedance varies with respect to each type of coaxial connector receptacle. As described above, if the characteristic impedance of the coaxial connector receptacle is mismatched with respect to the predetermined characteristic impedance, the reflection of a high-frequency signal occurs in the coaxial connector receptacle.

In addition, even in a case where the coaxial connector receptacle is not used, there is a possibility that the characteristic impedance of the signal line is mismatched with respect to the predetermined characteristic impedance, due to the following reason. In a case where the coaxial connector receptacle is not used, an external electrode, connected to the signal line, is provided on the surface of an end portion of the microstrip flexible substrate connection line. In addition, in a case where the microstrip flexible substrate connection line is connected to a circuit substrate, the external electrode is connected to a land electrode in the circuit substrate by a solder or the like. In this case, in the vicinity of the external electrode, a conductor shape or the like is different compared with the forming region of the signal line, and the characteristic impedance of an external electrode portion is different from the forming region of the signal line in some cases. As a result, there is a possibility that the characteristic impedance of the signal line is mismatched with respect to the predetermined characteristic impedance.

SUMMARY OF THE INVENTION

Accordingly, preferred embodiments of the present invention provide a high-frequency signal transmission line and an electronic device that significantly reduce or prevent mismatching of a characteristic impedance in a connector with respect to a predetermined characteristic impedance.

According to various preferred embodiments of the present invention, it is possible to obtain a high-frequency signal transmission line and an electronic device that significantly reduce or prevent mismatching of a characteristic impedance in a connector with respect to a predetermined characteristic impedance.

The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are appearance perspective views of a high-frequency signal transmission line according to a first preferred embodiment of the present invention.

FIG. 2 is an exploded view of a dielectric body of the high-frequency signal transmission line according to the first preferred embodiment of the present invention.

FIG. 3 is a cross-sectional structural view of the high-frequency signal transmission line according to the first preferred embodiment of the present invention.

FIGS. 4A and 4B are an appearance perspective view and a cross-sectional structural view of a connector for a high-frequency signal transmission line.

FIGS. 5A and 5B are diagrams of an electronic device in which a high-frequency signal transmission line is used, in a planar view from a y-axis direction and a z-axis direction.

FIG. 6 is a graph illustrating a characteristic impedance of the high-frequency signal transmission line according to the first preferred embodiment of the present invention.

FIG. 7 is an equivalent circuit diagram of a high-frequency signal transmission line.

FIG. 8 is a cross-sectional structural view of a high-frequency signal transmission line.

FIG. 9 is an exploded view of a dielectric body of a high-frequency signal transmission line according to a second preferred embodiment of the present invention.

FIG. 10 is a cross-sectional structural view of the high-frequency signal transmission line according to the second preferred embodiment of the present invention.

FIG. 11 is a graph illustrating a characteristic impedance of the high-frequency signal transmission line according to the second preferred embodiment of the present invention.

FIG. 12 is an exploded view of a dielectric body of a high-frequency signal transmission line according to a third preferred embodiment of the present invention.

FIGS. 13A and 13B are appearance perspective views of a high-frequency signal transmission line according to a first example of a modification of a preferred embodiment of the present invention.

FIGS. 14A and 14B are appearance perspective views of a high-frequency signal transmission line according to a second example of a modification of a preferred embodiment of the present invention.

FIG. 15 is an appearance perspective view of a high-frequency signal transmission line according to a fourth preferred embodiment of the present invention.

FIG. 16 is an appearance perspective view of the high-frequency signal transmission line according to the fourth preferred embodiment of the present invention.

FIG. 17 is an exploded perspective view of a dielectric body of the high-frequency signal transmission line in FIG. 15.

FIG. 18 is a perspective view of a connection portion between a high-frequency signal transmission line and a circuit substrate.

FIG. 19 is a cross-sectional structural view of a connection portion between a high-frequency signal transmission line and a circuit substrate.

FIG. 20 is a cross-sectional structural view of the high-frequency signal transmission line taken along a line XX-XX in FIG. 17.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, high-frequency signal transmission lines and an electronic device according to preferred embodiments of the present invention will be described with reference to drawings.

First Preferred Embodiment

Hereinafter, the configuration of a high-frequency signal transmission line according to a first preferred embodiment of the present invention will be described with reference to drawings. FIGS. 1A and 1B are appearance perspective views of a high-frequency signal transmission line 10 according to the first preferred embodiment. FIG. 2 is a exploded view of the dielectric body 12 of the high-frequency signal transmission line 10 according to the first preferred embodiment. FIG. 3 is a cross-sectional structural view of the high-frequency signal transmission line 10 according to the first preferred embodiment. FIGS. 4A and 4B are appearance perspective view and the cross-sectional structural view of a connector 100 b for the high-frequency signal transmission line 10. In FIGS. 1A and 1B to FIGS. 4A and 4B, the lamination direction of the high-frequency signal transmission line 10 is defined as a z-axis direction. In addition, the longitudinal direction of the high-frequency signal transmission line 10 is defined as an x-axis direction, and a direction perpendicular to the x-axis direction and the z-axis direction is defined as a y-axis direction.

The high-frequency signal transmission line 10 is used for, for example, connecting two high-frequency circuits within an electronic device such as a cellular phone. As illustrated in FIGS. 1A and 1B to FIG. 3, the high-frequency signal transmission line 10 includes the dielectric body 12, adjustment plates 15 (15 a and 15 b) (adjustment conductors), a signal line 20, terminal portions 23 (23 a and 23 b), a ground conductor 25, via hole conductors b1 and b2, and connectors 100 a and 100 b.

In a planar view from the z-axis direction, the dielectric body 12 extends in the x-axis direction, and includes a line portion 12 a and connection portions 12 b and 12 c. The dielectric body 12 is a laminated body preferably including a protective layer 14 and dielectric sheets (insulator layers) 18 (18 a and 18 b), illustrated in FIG. 2, being laminated in this order from a positive direction side in the z-axis direction to a negative direction side therein. In what follows, the main surface of the dielectric body 12 on the positive direction side in the z-axis direction is referred to as a front surface, and the main surface of the dielectric body 12 on the negative direction side in the z-axis direction is referred to as a back surface.

The line portion 12 a extends in the x-axis direction. The connection portions 12 b and 12 c are connected to an end portion of the line portion 12 a on a negative direction side in the x-axis direction and an end portion of the line portion 12 a on a positive direction side in the x-axis direction, respectively, and have respective rectangular or substantially rectangular shapes. The widths of the connection portions 12 b and 12 c in the y-axis direction are wider than the width of the line portion 12 a in the y-axis direction.

The dielectric sheet 18 extends in the x-axis direction, and preferably has the same or substantially the same shape as the dielectric body 12 in a planar view from the z-axis direction. The dielectric sheet 18 is preferably made of a thermoplastic resin having flexibility, such as polyimide or liquid crystalline polymer. The thickness of the dielectric sheet 18 after lamination preferably ranges, for example, from about 50 μm to about 200 μm. Hereinafter, the main surface of the dielectric sheet 18 on the positive direction side in the z-axis direction is referred to as a front surface, and the main surface of the dielectric sheet 18 on the negative direction side in the z-axis direction is referred to as a back surface.

In addition, the dielectric sheet 18 a includes a line portion 18 a-a and connection portions 18 a-b and 18 a-c. The dielectric sheet 18 b includes a line portion 18 b-a and connection portions 18 b-b and 18 b-c. The line portions 18 a-a and 18 b-a configure the line portion 12 a. The connection portions 18 a-b and 18 b-b configure the connection portion 12 b. The connection portions 18 a-c and 18 b-c configure the connection portion 12 c.

As illustrated in FIG. 2, the signal line 20 is a linear conductor provided within the dielectric body 12, and extends in the x-axis direction on the front surface of the dielectric sheet 18 a. Both the respective end portions of the signal line 20 are located in the centers of the connection portions 18 a-b and 18 a-c in a planar view from the z-axis direction. The signal line 20 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper. In addition, both end portions of the signal line 20 preferably are gold-plated.

As illustrated in FIG. 2, the ground conductor 25 (a first ground conductor) is provided within the dielectric body 12 on the negative direction side in the z-axis direction, compared with the signal line 20 (in other words, on the back surface side of the dielectric body 12, compared with the signal line 20), and in more detail, provided on the front surface of the dielectric sheet 18 b. The ground conductor 25 extends in the x-axis direction along the signal line 20 on the front surface of the dielectric sheet 18 b, and faces the signal line 20 across the dielectric sheet 18 a, as illustrated in FIG. 2. As a result, the signal line 20 and the ground conductor 25 form a microstrip line structure. The ground conductor 25 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

In addition, the ground conductor 25 includes a main conductor 25 a and terminal conductors 25 b and 25 c. The main conductor 25 a is provided on the front surface of the line portion 18 b-a, and extends in the x-axis direction.

The terminal conductor 25 b is provided on the front surface of the connection portion 18 b-b, and defines a rectangular or substantially rectangular ring surrounding the center of the connection portion 18 b-b. As a result, in the ground conductor 25, a conductor-missing portion Oa is provided in a region surrounded by the terminal conductor 25 b. As a result, an end portion of the signal line 20 on the negative direction side in the x-axis direction is located within the conductor-missing portion Oa in a planar view from the z-axis direction. The terminal conductor 25 b is connected to an end portion of the main conductor 25 a on the negative direction side in the x-axis direction.

The terminal conductor 25 c is provided on the front surface of the connection portion 18 b-c, and has a ring-shaped rectangular or substantially rectangular shape surrounding the center of the connection portion 18 b-c. As a result, in the ground conductor 25, a conductor-missing portion Ob is provided in a region surrounded by the terminal conductor 25 c. As a result, an end portion of the signal line 20 on the positive direction side in the x-axis direction is located within the conductor-missing portion Ob in a planar view from the z-axis direction. The terminal conductor 25 c is connected to an end portion of the main conductor 25 a on the positive direction side in the x-axis direction.

The terminal conductor 23 a is provided on the front surface of the connection portion 18 a-b, and has an angular U-shape surrounding the center of the connection portion 18 a-b (in other words, an end portion of the signal line 20 on the negative direction side in the x-axis direction). The terminal conductor 23 a has a shape that is open toward the positive direction side in the x-axis direction. In addition, in a planar view from the z-axis direction, the terminal conductor 23 a overlaps with the terminal conductor 25 b.

The terminal conductor 23 b is provided on the front surface of the connection portion 18 a-c, and has an angular U-shape surrounding the center of the connection portion 18 a-c (in other words, an end portion of the signal line 20 on the positive direction side in the x-axis direction). The terminal conductor 23 b has a shape that is open toward the negative direction side in the x-axis direction. In addition, in a planar view from the z-axis direction, the terminal conductor 23 b overlaps with the terminal conductor 25 c.

The via hole conductor b1 penetrates the connection portion 18 a-b of the dielectric sheet 18 a in the z-axis direction. The via hole conductor b1 connects the terminal conductor 23 a and the terminal conductor 25 b to each other. The via hole conductor b2 penetrates the connection portion 18 a-c of the dielectric sheet 18 a in the z-axis direction. The via hole conductor b2 connects the terminal conductor 23 b and the terminal conductor 25 c to each other.

The protective layer 14 covers substantially the entire surface of the front surface of the dielectric sheet 18 a. As a result, the protective layer 14 covers the signal line 20 and the terminal conductors 23 a and 23 b. The protective layer 14 is made of, for example, a flexible resin such as a resist material.

In addition, as illustrated in FIG. 2, the protective layer 14 includes a line portion 14 a and connection portions 14 b and 14 c. The line portion 14 a covers the signal line 20 by covering the entire surface of the front surface of the line portion 18 a-a.

The connection portion 14 b is connected to an end portion of the line portion 14 a on the negative direction side in the x-axis direction, and covers the front surface of the connection portion 18 a-b. In this regard, however, in the connection portion 14 b, openings Ha to Hd are provided. The opening Ha is a rectangular or substantially rectangular opening provided at substantially the center of the connection portion 14 b. An end portion of the signal line 20 on the negative direction side in the x-axis direction is exposed to the outside through the opening Ha, and hence, functions as an external terminal. In addition, the opening Hb is a rectangular or substantially rectangular opening provided on the positive direction side of the opening Ha in the y-axis direction. The opening Hc is a rectangular or substantially rectangular opening provided on the negative direction side of the opening Ha in the x-axis direction. The opening Hd is a rectangular or substantially rectangular opening provided on the negative direction side of the opening Ha in the y-axis direction. The terminal conductor 23 a is exposed to the outside through the openings Hb to Hd, and hence, functions as an external terminal.

The connection portion 14 c is connected to an end portion of the line portion 14 a on the positive direction side in the x-axis direction, and covers the front surface of the connection portion 18 a-c. In this regard, however, in the connection portion 14 c, openings He to Hh are provided. The opening He is a rectangular or substantially rectangular opening provided at substantially the center of the connection portion 14 c. An end portion of the signal line 20 on the positive direction side in the x-axis direction is exposed to the outside through the opening He, and hence, functions as an external terminal. In addition, the opening Hf is a rectangular or substantially rectangular opening provided on the positive direction side of the opening He in the y-axis direction. The opening Hg is a rectangular or substantially rectangular opening provided on the positive direction side of the opening He in the x-axis direction. The opening Hh is a rectangular or substantially rectangular opening provided on the negative direction side of the opening He in the y-axis direction. The terminal conductor 23 b is exposed to the outside through the openings Hf to Hh, and hence, functions as an external terminal.

The adjustment plate 15 a is provided on the back surface of the connection portion 12 b of the dielectric body 12 (in other words, the back surface of the connection portion 18 b-b of the dielectric sheet 18 b), and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Oa in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 a is not electrically connected to any one of the signal line 20 and the ground conductor 25, and is maintained at a floating potential. In more detail, the adjustment plate 15 a overlaps with the whole of the conductor-missing portion Oa in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the negative direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15 a protrudes out of the conductor-missing portion Oa, and hence, overlaps with the terminal conductor 25 b of the ground conductor 25 in a planar view from the z-axis direction. As a result, capacitance is generated between the adjustment plate 15 a and the terminal conductor 25 b of the ground conductor 25.

The adjustment plate 15 b is provided on the back surface of the connection portion 12 c of the dielectric body 12 (in other words, the back surface of the connection portion 18 b-c of the dielectric sheet 18 b), and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Ob in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 b is not electrically connected to any one of the signal line 20 and the ground conductor 25, and is maintained at a floating potential. In more detail, the adjustment plate 15 b overlaps with the whole of the conductor-missing portion Ob in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the positive direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction. Furthermore, the adjustment plate 15 b protrudes out of the conductor-missing portion Ob, and hence, overlaps with the terminal conductor 25 c of the ground conductor 25 in a planar view from the z-axis direction. As a result, capacitance is generated between the adjustment plate 15 b and the terminal conductor 25 c of the ground conductor 25. The adjustment plates 15 a and 15 b are configured by, for example, copper plates or SUS plates.

The connectors 100 a and 100 b are mounted on the front surfaces of the connection portions 12 b and 12 c, respectively, and individually electrically connected to the signal line 20 and the ground conductor 25. Since the configurations of the connectors 100 a and 100 b are equal to each other, the configuration of the connector 100 b will be cited as an example and described, hereinafter.

As illustrated in FIGS. 1A and 1B and FIGS. 4A and 4B, the connector 100 b includes a connector main body 102, external terminals 104 and 106, a center conductor 108, and an external conductor 110. The connector main body 102 has a shape in which a cylinder is connected to a rectangular or substantially rectangular plate, and is manufactured using an insulating material such as a resin.

In the surface of the plate of the connector main body 102 on the negative direction side in the z-axis direction, the external terminal 104 is provided in a position in which to face an end portion of the signal line 20 on the positive direction side in the x-axis direction. In the surface of the plate of the connector main body 102 on the negative direction side in the z-axis direction, the external terminal 106 is provided in a position to correspond to the terminal conductor 23 b exposed through the openings Hf to Hh.

The center conductor 108 is provided in the center of the cylinder of the connector main body 102, and connected to the external terminal 104. The center conductor 108 is a signal terminal from which a high-frequency signal is input or output. The external conductor 110 is provided on the inner peripheral surface of the cylinder of the connector main body 102, and connected to the external terminal 106. The external conductor 110 is a ground terminal maintained at a ground potential.

The connector 100 b configured in such a way as described above is mounted on the front surface of the connection portion 12 c so that the external terminal 104 is connected to an end portion of the signal line 20 on the positive direction side in the x-axis direction and the external terminal 106 is connected to the terminal conductor 23 b. As a result, the signal line 20 is electrically connected to the center conductor 108. In addition, the ground conductor 25 is electrically connected to the external conductor 110.

In addition, in a planar view from the z-axis direction, the connector 100 b overlaps with the conductor-missing portion Ob provided in the terminal conductor 25 c of the ground conductor 25, as illustrated in FIG. 3. In this regard, however, it is not necessary for the connector 100 b and the conductor-missing portion Ob to correspondently overlap with each other in a planar view from the z-axis direction. Therefore, it is only necessary for the conductor-missing portion Ob to be provided because no conductor is provided in at least a portion of a region overlapping with the connector 100 b, in a planar view from the z-axis direction. As illustrated in FIG. 3, in the high-frequency signal transmission line 10, the connector 100 b protrudes out of the conductor-missing portion Ob in a planar view from the z-axis direction.

The high-frequency signal transmission line 10 is used in such a way as described below. FIGS. 5A and 5B are the diagrams of an electronic device 200 in which the high-frequency signal transmission line 10 is used, in a planar view from the y-axis direction and the z-axis direction.

The electronic device 200 includes the high-frequency signal transmission line 10, circuit substrates 202 a and 202 b, receptacles 204 a and 204 b, a battery pack (metallic body) 206, and a housing 210.

The housing 210 contains the high-frequency signal transmission line 10, the circuit substrates 202 a and 202 b, the receptacles 204 a and 204 b, and the battery pack (metallic body) 206. In the circuit substrate 202 a, for example, a transmitting circuit or receiving circuit including an antenna is provided. In the circuit substrate 202 b, for example, a feed circuit is provided. The battery pack 206 is, for example, a lithium-ion secondary battery, and has a structure in which the surface thereof is covered by a metal cover. The circuit substrate 202 a, the battery pack 206, and the circuit substrate 202 b are arranged in this order from the negative direction side to the positive direction side in the x-axis direction.

The receptacles 204 a and 204 b are provided on the main surfaces of the circuit substrates 202 a and 202 b on the negative direction side in the z-axis direction, respectively. The connectors 100 a and 100 b are connected to the receptacles 204 a and 204 b, respectively. In other words, through the front surface of the connection portion 12 b, the signal line 20 and the circuit substrate 202 a are electrically connected to each other. Through the front surface of the connection portion 12 c, the signal line 20 and the circuit substrate 202 b are electrically connected to each other. As a result, through the receptacles 204 a and 204 b, a high-frequency signal, which has the frequency of, for example, 2 GHz and is transmitted between the circuit substrates 202 a and 202 b, is applied to the center conductors 108 of the connectors 100 a and 100 b. In addition, through the circuit substrates 202 a and 202 b and the receptacles 204 a and 204 b, the external conductors 110 of the connectors 100 a and 100 b are maintained at a ground potential. As a result, the high-frequency signal transmission line 10 establishes electrical connection between the circuit substrates 202 a and 202 b.

Here, the front surface of the dielectric body 12 (more correctly, the protective layer 14) is in contact with the battery pack 206. In addition, the front surface of the dielectric body 12 and the battery pack 206 are fixed to each other by an adhesive or the like.

Hereinafter, a non-limiting example of a manufacturing method for the high-frequency signal transmission line 10 will be described with reference to FIG. 2. While, hereinafter, a case where one high-frequency signal transmission line 10 is manufactured will be cited as an example and described, actually large-sized dielectric sheets are laminated and cut, and hence, a plurality of high-frequency signal transmission lines 10 are simultaneously manufactured.

First, the dielectric sheet 18 made of a thermoplastic resin is prepared where copper foil is formed on the entire surface of the front surface thereof. The surface of the copper foil of the dielectric sheet 18 is smoothed by being subjected to, for example, zinc plating used for antirust. The thickness of the copper foil preferably ranges from about 10 μm to about 20 μm.

Next, using a photolithography process, the signal line 20 and the terminal conductors 23 a and 23 b, illustrated in FIG. 2, are formed on the front surface of the dielectric sheet 18 a. Specifically, on the copper foil of the dielectric sheet 18 a, resists are printed that have the same shapes as the signal line 20 and the terminal conductors 23 a and 23 b, illustrated in FIG. 2. In addition, by performing an etching processing on the copper foil, the copper foil of a portion not covered by the resist is removed. After that, the resist is removed. As a result, such a signal line 20 and terminal conductors 23 a and 23 b as illustrated in FIG. 2 are formed on the front surface of the dielectric sheet 18 a.

Next, using a photolithography process, the ground conductor 25 illustrated in FIG. 2 is formed on the front surface of the dielectric sheet 18 b. In addition, since the photolithography process here is preferably the same as the photolithography process in a case where the signal line 20 and the terminal conductors 23 a and 23 b are formed, the description thereof will be omitted.

Next, positions in which to form the via hole conductors b1 and b2 in the dielectric sheet 18 a are subjected to a laser beam from the back surface side, and through holes are formed. After that, the through holes formed in the dielectric sheet 18 a are filled with conductive pastes.

Next, the dielectric sheets 18 a and 18 b are stacked in this order from the positive direction side to the negative direction side in the z-axis direction. In addition, by applying heat and pressure to the dielectric sheets 18 a and 18 b from the positive direction side and the negative direction side in the z-axis direction, the dielectric sheets 18 a and 18 b are softened to be pressure-bonded and integrated and the conductive pastes with which the through holes have been filled are solidified to form the via hole conductors b1 and b2 illustrated in FIG. 2. In addition, the individual dielectric sheets 18 may also be integrated using an adhesive such as an epoxy based resin in place of the thermocompression bonding. In addition, through holes may also be formed after the dielectric sheets 18 have been integrated, and by filling the through holes with conductive pastes or forming plated films in the through holes, the via hole conductors b1 and b2 may also be formed. In addition, in the via hole conductors b1 and b2, it is not necessary for the through holes to be completely filled with conductors, and the via hole conductors b1 and b2 may also be formed by, for example, forming conductors only along the inner peripheral surfaces of the through holes.

Next, by applying a resin (resist) paste, the protective layer 14 is formed on the dielectric sheet 18 a.

Finally, using an adhesive or the like, the adjustment plates 15 a and 15 b are stuck to the back surfaces of the connection portions 12 b and 12 c. As a result, the high-frequency signal transmission line 10 illustrated in FIGS. 1A and 1B is obtained.

According to the high-frequency signal transmission line 10 configured in such a way as described above, it is possible to significantly reduce or prevent the mismatching of characteristic impedances in the connectors 100 a and 100 b with respect to predetermined characteristic impedances. FIG. 6 is a graph illustrating the characteristic impedance of the high-frequency signal transmission line 10 according to the first preferred embodiment. A vertical axis indicates the characteristic impedance, and a horizontal axis indicates an x-axis. A solid line in FIG. 6 indicates the characteristic impedance of the high-frequency signal transmission line 10, and a dotted line in FIG. 6 indicates the characteristic impedance of a high-frequency signal transmission line according to a comparative example. In the high-frequency signal transmission line according to the comparative example, the adjustment plates 15 a and 15 b are not provided. FIG. 7 is the equivalent circuit diagram of the high-frequency signal transmission line 10. FIG. 8 is the cross-sectional structural view of the high-frequency signal transmission line 10.

In the high-frequency signal transmission line according to the comparative example, when the connectors 100 a and 100 b have been mounted on both end portions of the dielectric body 12, characteristic impedances in the connectors 100 a and 100 b are mismatched with respect to the predetermined characteristic impedance (e.g., about 50Ω). Here, the connectors 100 a and 100 b have been designed so that the characteristic impedances of the connectors 100 a and 100 b become slightly higher than the predetermined characteristic impedance.

Therefore, in the high-frequency signal transmission line 10, the adjustment plates 15 a and 15 b are individually provided on the back surface of the dielectric body 12, and overlap with at least portions of the conductor-missing portions Oa and Ob, respectively, in a planar view from the z-axis direction. As a result, as illustrated in FIG. 7 and FIG. 8, capacitances C2 turn out to be generated between the adjustment plates 15 a and 15 b and the end portions of the signal line 20. Furthermore, capacitances C3 turn out to be generated between the adjustment plates 15 a and 15 b and the terminal conductors 25 b and 25 c of the ground conductor 25. In other words, between the signal line 20 and the ground conductor 25, the capacitances C2 are C3 are connected in series.

Here, when the capacitances C2 and C3 have been connected in series, the combined capacitance Ct of the capacitances C2 and C3 becomes a minute value. Accordingly, the minute combined capacitances Ct are generated in the connectors 100 a and 100 b, and it becomes possible to slightly reduce the characteristic impedances of the connectors 100 a and 100 b. In other words, it is possible to finely adjust the characteristic impedances of the connectors 100 a and 100 b. As a result of the above features, in the high-frequency signal transmission line 10, by providing the conductor-missing portions Oa and Ob and the adjustment plates 15 a and 15 b, it is possible to match the characteristic impedances of the connectors 100 a and 100 b to the predetermined characteristic impedance with a high degree of accuracy.

In addition, in a case where the connectors 100 a and 100 b are attached to the receptacles 204 a and 204 b, forces are applied to the connection portions 12 b and 12 c. Therefore, there is a possibility that the connection portions 12 b and 12 c are greatly deformed and damaged. Therefore, in the high-frequency signal transmission line 10, the adjustment plates 15 a and 15 b are provided in the connection portions 12 b and 12 c, the adjustment plates 15 a and 15 b being more rigid than the dielectric body 12. As a result, the large deformations of the connection portions 12 b and 12 c are significantly reduced or prevented, and the damages of the connection portions 12 b and 12 c are significantly reduced or prevented.

Second Preferred Embodiment

Hereinafter, the configuration of a high-frequency signal transmission line according to a second preferred embodiment of the present invention will be described with reference to drawings. FIG. 9 is an exploded view of the dielectric body 12 of a high-frequency signal transmission line 10 a according to the second preferred embodiment. FIG. 10 is a cross-sectional structural view of the high-frequency signal transmission line 10 a according to the second preferred embodiment. In addition, as for the appearance perspective view of the high-frequency signal transmission line 10 a, FIGS. 1A and 1B are incorporated.

As illustrated in FIGS. 1A and 1B and FIG. 9, the high-frequency signal transmission line 10 a includes the dielectric body 12, external terminals 16 (16 a and 16 b), connection conductors 17 (17 a and 17 b), a signal line 20, ground conductors 22 and 24, via hole conductors b11 to b14 and B1 to B6, and connectors 100 a and 100 b.

In a planar view from the z-axis direction, the dielectric body 12 extends in the x-axis direction, and includes a line portion 12 a and connection portions 12 b and 12 c. The dielectric body 12 is a laminated body configured by a protective layer 14 and dielectric sheets (insulator layers) 18 (18 a to 18 d), illustrated in FIG. 2, being laminated in this order from the positive direction side in the z-axis direction to the negative direction side therein. In what follows, the main surface of the dielectric body 12 on a positive direction side in the z-axis direction is referred to as a front surface, and the main surface of the dielectric body 12 on a negative direction side in the z-axis direction is referred to as a back surface.

The line portion 12 a extends in the x-axis direction. The connection portions 12 b and 12 c are connected to an end portion of the line portion 12 a on a negative direction side in the x-axis direction and an end portion of the line portion 12 a on a positive direction side in the x-axis direction, respectively, and have respective rectangular or substantially rectangular shapes. The widths of the connection portions 12 b and 12 c in the y-axis direction are wider than the width of the line portion 12 a in the y-axis direction.

The dielectric sheet 18 extends in the x-axis direction, and preferably has the same or substantially the same shape as the dielectric body 12 in a planar view from the z-axis direction. The dielectric sheet 18 is configured by a thermoplastic resin having flexibility, such as polyimide or liquid crystalline polymer. The thickness of the dielectric sheet 18 after lamination preferably ranges, for example, from about 50 μm to about 200 μm. Hereinafter, the main surface of the dielectric sheet 18 on the positive direction side in the z-axis direction is referred to as a front surface, and the main surface of the dielectric sheet 18 on the negative direction side in the z-axis direction is referred to as a back surface.

In addition, the dielectric sheet 18 a includes a line portion 18 a-a and connection portions 18 a-b and 18 a-c. The dielectric sheet 18 b includes a line portion 18 b-a and connection portions 18 b-b and 18 b-c. The dielectric sheet 18 c includes a line portion 18 c-a and connection portions 18 c-b and 18 c-c. The dielectric sheet 18 d includes a line portion 18 d-a and connection portions 18 d-b and 18 d-c. The line portions 18 a-a, 18 b-a, 18 c-a, and 18 d-a configure the line portion 12 a. The connection portions 18 a-b, 18 b-b, 18 c-b, and 18 d-b configure the connection portion 12 b. The connection portions 18 a-c, 18 b-c, 18 c-c, and 18 d-c configure the connection portion 12 c.

As illustrated in FIGS. 1A and 1B and FIG. 9, the external terminal 16 a is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 a-b. As illustrated in FIGS. 1A and 1B and FIG. 9, the external terminal 16 b is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 a-c. The external terminals 16 a and 16 b are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper. In addition, the surfaces of the external terminals 16 a and 16 b preferably are gold-plated.

As illustrated in FIGS. 1A and 1B and FIG. 9, the connection conductor 17 a is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 b-b, and overlaps with the external terminal 16 a in a planar view from the z-axis direction. As illustrated in FIGS. 1A and 1B and FIG. 9, the connection conductor 17 b is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 b-c, and overlaps with the external terminal 16 b in a planar view from the z-axis direction. The connection conductors 17 a and 17 b are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper.

As illustrated in FIG. 9, the signal line 20 is a linear conductor provided within the dielectric body 12 and extends on the front surface of the dielectric sheet 18 c in the x-axis direction. Both the respective end portions of the signal line 20 overlap with the external terminals 16 a and 16 b and the connection conductors 17 a and 17 b in a planar view from the z-axis direction. The signal line 20 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

As illustrated in FIG. 9, the ground conductor 22 (a second ground conductor) is provided within the dielectric body 12 on the positive direction side in the z-axis direction, compared with the signal line 20 (in other words, on the front surface side of the dielectric body 12), and in more detail, provided on the front surface of the dielectric sheet 18 a. The ground conductor 22 extends in the x-axis direction along the signal line 20 on the front surface of the dielectric sheet 18 a, and faces the signal line 20 across the dielectric sheets 18 a and 18 b, as illustrated in FIG. 9.

In addition, the ground conductor 22 includes a main conductor 22 a and terminal conductors 22 b and 22 c. The main conductor 22 a is provided on the front surface of the line portion 18 a-a, and extends in the x-axis direction. In the main conductor 22 a, practically no opening is provided. In other words, the main conductor 22 a is an electrode continuously extending along the signal line 20 in the line portion 12 a in the x-axis direction, namely, a so-called flat plate-shaped electrode. In this regard, however, it is not necessary for the main conductor 22 a to completely cover the line portion 12 a, and for example, a small hole or the like may also be provided in a predetermined position in the main conductor 22 a so as to allow gas to escape, the gas occurring when the thermoplastic resin of the dielectric sheet 18 is subjected to thermocompression bonding. The main conductor 22 a is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

The terminal conductor 22 b is provided on the front surface of the connection portion 18 a-b, and defines a rectangular or substantially rectangular ring surrounding the circumference of the external terminal 16 a. The terminal conductor 22 b is connected to an end portion of the main conductor 22 a on the negative direction side in the x-axis direction. The terminal conductor 22 c is provided on the front surface of the connection portion 18 a-c, and has a ring-shaped rectangular or substantially rectangular shape surrounding the circumference of the external terminal 16 b. The terminal conductor 22 c is connected to an end portion of the main conductor 22 a on the positive direction side in the x-axis direction.

Here, the characteristic impedance of the high-frequency signal transmission line 10 a is defined mainly on the basis of a facing area and a distance between the signal line 20 and the ground conductor 22 and the relative permittivities of the dielectric sheets 18 a to 18 d. Therefore, in a case where the characteristic impedance of the high-frequency signal transmission line 10 a is set to 50Ω, for example, designing is performed, for example, so that the characteristic impedance of the high-frequency signal transmission line 10 a becomes 55Ω, for example, because of the signal line 20 and the ground conductor 22, the 55Ω being slightly higher than 50Ω. In addition, the shape of the after-mentioned ground conductor 24 is adjusted so that the characteristic impedance of the high-frequency signal transmission line 10 a becomes 50Ω because of the signal line 20, the ground conductor 22, and the after-mentioned ground conductor 24. As described above, the ground conductor 22 functions as a reference-ground electrode.

As illustrated in FIG. 9, the ground conductor 24 (a first ground conductor) is provided within the dielectric body 12 on the negative direction side in the z-axis direction, compared with the signal line 20 (in other words, on the back surface side of the dielectric body 12), and in more detail, provided on the front surface of the dielectric sheet 18 d. The ground conductor 24 extends in the x-axis direction along the signal line 20 on the front surface of the dielectric sheet 18 d, and faces the signal line 20 across the dielectric sheet 18 c, as illustrated in FIG. 9. The ground conductor 24 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

In addition, the ground conductor 24 includes a line conductor 24 a and terminal conductors 24 b and 24 c. The line conductor 24 a is provided on the front surface of the line portion 18 d-a, and extends in the x-axis direction. In addition, a plurality of openings 30 in which no conductor layers are formed and a plurality of bridge portions 60 serving as portions in which conductor layers are formed are alternately provided along the signal line 20, and hence, the line conductor 24 a has a ladder shape. As illustrated in FIG. 9, in a planar view from the z-axis direction, the opening 30 has an elliptical or substantially elliptical shape having a longitudinal direction in the x-axis direction, and overlaps with the signal line 20. As a result, in a planar view from the z-axis direction, the signal line 20 alternately overlaps with the openings 30 and the bridge portions 60. In addition, the openings 30 are arranged at equal intervals.

The terminal conductor 24 b is provided on the front surface of the connection portion 18 d-b, and defines a rectangular or substantially rectangular ring surrounding the center of the connection portion 18 d-b. As a result, in the ground conductor 24, a conductor-missing portion Oa is provided in a region surrounded by the terminal conductor 24 b. In addition, an end portion of the signal line 20 on the negative direction side in the x-axis direction is located within the conductor-missing portion Oa in a planar view from the z-axis direction. The terminal conductor 24 b is connected to an end portion of the line conductor 24 a on the negative direction side in the x-axis direction.

The terminal conductor 24 c is provided on the front surface of the connection portion 18 d-c, and defines a rectangular or substantially rectangular ring surrounding the center of the connection portion 18 d-c. As a result, in the ground conductor 24, a conductor-missing portion Ob is provided in a region surrounded by the terminal conductor 24 c. In addition, an end portion of the signal line 20 on the positive direction side in the x-axis direction is located within the conductor-missing portion Ob in a planar view from the z-axis direction. The terminal conductor 24 c is connected to an end portion of the line conductor 24 a on the positive direction side in the x-axis direction.

The ground conductor 24 is an auxiliary ground conductor also functioning as a shield. In addition, as described above, the ground conductor 24 is designed in order to make a final adjustment so that the characteristic impedance of the high-frequency signal transmission line 10 a becomes about 50Ω, for example. Specifically, the size of the opening 30, the line width of the bridge portion 60, and so forth are designed.

As described above, no opening is provided in the ground conductor 22, and the openings 30 are provided in the ground conductor 24. Accordingly, an area where the ground conductor 24 and the signal line 20 face each other is smaller than an area where the ground conductor 22 and the signal line 20 face each other.

Here, as illustrated in FIG. 9, in the high-frequency signal transmission line 10 a, a region where the opening 30 is provided is referred to as a region A1, and a region where the bridge portion 60 is provided is referred to as a region A2. In other words, the signal line 20 overlaps with the opening 30 in the region A1, and the signal line 20 overlaps with the bridge portion 60 and does not overlap with the opening 30, in the region A2. The regions A1 and the regions A2 are alternately arranged in the x-axis direction.

In addition, as illustrated in FIG. 9, the line width Wa of the signal line 20 in the region A1 is larger than the line width Wb of the signal line 20 in the region A2. Since the signal line 20 does not overlap with the ground conductor 24 in the region A1, it is possible to reduce the high-frequency resistance value of the signal line by enlarging the line width Wa. On the other hand, since the signal line 20 overlaps with the ground conductor 24 in the region A2, the line width Wb is set to be smaller than the region A1 so as to suppress the reduction of the high-frequency resistance value.

The via hole conductor b11 penetrates the connection portion 18 a-b of the dielectric sheet 18 a in the z-axis direction, and connects the external terminal 16 a and the connection conductor 17 a to each other. The via hole conductor b13 penetrates the connection portion 18 b-b of the dielectric sheet 18 b in the z-axis direction, and connects the connection conductor 17 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction to each other. As a result, an end portion of the signal line 20 on the negative direction side in the x-axis direction is connected to the external terminal 16 a.

The via hole conductor b12 penetrates the connection portion 18 a-c of the dielectric sheet 18 a in the z-axis direction, and connects the external terminal 16 b and the connection conductor 17 b to each other. The via hole conductor b14 penetrates the connection portion 18 b-c of the dielectric sheet 18 b in the z-axis direction, and connects the connection conductor 17 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction to each other. As a result, an end portion of the signal line 20 on the positive direction side in the x-axis direction is connected to the external terminal 16 b. The via hole conductors b11 to b14 are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper.

The plural via hole conductors B1 to B3 penetrate the line portions 18 a-a, 18 b-a, and 18 c-a of the dielectric sheets 18 a, 18 b, and 18 c in the z-axis direction and are laid out in lines in the line portions 18 a-a, 18 b-a, and 18 c-a at equal intervals, respectively. In a planar view from the z-axis direction, the via hole conductors B1 to B3 are provided on a positive direction side in the y-axis direction, compared with the signal line 20. In addition, the via hole conductors B1 to B3 configure one via hole conductor by being connected to each other, and connect the ground conductor 22 and the ground conductor 24 to each other. The via hole conductors B1 to B3 are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper.

The plural via hole conductors B4 to B6 penetrate the line portions 18 a-a, 18 b-a, and 18 c-a of the dielectric sheets 18 a, 18 b, and 18 c in the z-axis direction and are laid out in lines in the line portions 18 a-a, 18 b-a, and 18 c-a at equal intervals, respectively. In a planar view from the z-axis direction, the via hole conductors B4 to B6 are provided on a negative direction side in the y-axis direction, compared with the signal line 20. In addition, the via hole conductors B4 to B6 configure one via hole conductor by being connected to each other, and connect the ground conductor 22 and the ground conductor 24 to each other. The via hole conductor B4 to B6 are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper.

As described above, the signal line 20 and the ground conductors 22 and 24 define a triplate-type strip line structure. In addition, as illustrated in FIG. 10, an interval between the signal line 20 and the ground conductor 22 is approximately equal to the thickness T1 of the sum of the dielectric sheets 18 a and 18 b, and preferably ranges, for example, from about 50 μm to about 300 μm. In the present preferred embodiment, the interval between the signal line 20 and the ground conductor 22 preferably is about 150 μm, for example. On the other hand, as illustrated in FIG. 10, an interval between the signal line 20 and the ground conductor 24 is approximately equal to the thickness T2 of the dielectric sheet 18 c, and ranges, for example, from about 10 μm to about 100 μm. In the present preferred embodiment, the interval between the signal line 20 and the ground conductor 24 preferably is about 50 μm, for example. In other words, the thickness T1 is designed so as to be larger than the thickness T2.

The protective layer 14 covers substantially the entire surface of the front surface of the dielectric sheet 18 a. As a result, the protective layer 14 covers the ground conductor 22. The protective layer 14 is made of, for example, a flexible resin such as a resist material.

In addition, as illustrated in FIG. 9, the protective layer 14 includes a line portion 14 a and connection portions 14 b and 14 c. The line portion 14 a covers the main conductor 22 a by covering the entire surface of the front surface of the line portion 18 a-a.

The connection portion 14 b is connected to an end portion of the line portion 14 a on the negative direction side in the x-axis direction, and covers the front surface of the connection portion 18 a-b. In this regard, however, in the connection portion 14 b, openings Ha to Hd are provided. The opening Ha is a rectangular or substantially rectangular opening provided at substantially the center of the connection portion 14 b. The external terminal 16 a is exposed to the outside through the opening Ha. In addition, the opening Hb is a rectangular or substantially rectangular opening provided on the positive direction side of the opening Ha in the y-axis direction. The opening Hc is a rectangular or substantially rectangular opening provided on the negative direction side of the opening Ha in the x-axis direction. The opening Hd is a rectangular or substantially rectangular opening provided on the negative direction side of the opening Ha in the y-axis direction. The terminal conductor 22 b is exposed to the outside through the openings Hb to Hd, and hence, functions as an external terminal.

The connection portion 14 c is connected to an end portion of the line portion 14 a on the positive direction side in the x-axis direction, and covers the front surface of the connection portion 18 a-c. In this regard, however, in the connection portion 14 c, openings He to Hh are provided. The opening He is a rectangular or substantially rectangular opening provided at substantially the center of the connection portion 14 c. The external terminal 16 b is exposed to the outside through the opening He. In addition, the opening Hf is a rectangular or substantially rectangular opening provided on the positive direction side of the opening He in the y-axis direction. The opening Hg is a rectangular or substantially rectangular opening provided on the positive direction side of the opening He in the x-axis direction. The opening Hh is a rectangular or substantially rectangular opening provided on the negative direction side of the opening He in the y-axis direction. The terminal conductor 22 c is exposed to the outside through the openings Hf to Hh, and hence, functions as an external terminal.

The adjustment plate 15 a is provided on the back surface of the connection portion 12 b of the dielectric body 12, and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Oa in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 a is not electrically connected to any one of the signal line 20 and the ground conductors 22 and 24. In more detail, the adjustment plate 15 a overlaps with the whole of the conductor-missing portion Oa in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the negative direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15 a protrudes out of the conductor-missing portion Oa, and hence, overlaps with the terminal conductor 24 b of the ground conductor 24. As a result, capacitance is generated between the adjustment plate 15 a and the terminal conductor 24 b of the ground conductor 24.

The adjustment plate 15 b is provided on the back surface of the connection portion 12 c of the dielectric body 12, and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Ob in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 b is not electrically connected to any one of the signal line 20 and the ground conductors 22 and 24. In more detail, the adjustment plate 15 b overlaps with the whole of the conductor-missing portion Ob in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the positive direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction. Furthermore, the adjustment plate 15 b protrudes out of the conductor-missing portion Ob, and hence, overlaps with the terminal conductor 24 c of the ground conductor 24. As a result, capacitance is generated between the adjustment plate 15 b and the terminal conductor 24 c of the ground conductor 24.

In addition, since the configurations of the connectors 100 a and 100 b in the high-frequency signal transmission line 10 a are the same as the configurations of the connectors 100 a and 100 b in the high-frequency signal transmission line 10, the description thereof will be omitted.

According to the high-frequency signal transmission line 10 a configured in such a way as described above, it is possible to significantly reduce or prevent the mismatching of characteristic impedances in the connectors 100 a and 100 b with respect to predetermined characteristic impedances, in the same way as the high-frequency signal transmission line 10. FIG. 11 is a graph illustrating the characteristic impedance of the high-frequency signal transmission line 10 a according to the second preferred embodiment. A vertical axis indicates the characteristic impedance, and a horizontal axis indicates an x-axis. A solid line in FIG. 11 indicates the characteristic impedance of the high-frequency signal transmission line 10 a, and a dotted line in FIG. 11 indicates the characteristic impedance of a high-frequency signal transmission line according to a comparative example. In the high-frequency signal transmission line according to the comparative example, the adjustment plates 15 a and 15 b are not provided.

As illustrated in FIG. 11, in the high-frequency signal transmission line 10 a, in the same way as the high-frequency signal transmission line 10, the connectors 100 a and 100 b have been designed so that the characteristic impedances of the connectors 100 a and 100 b become slightly higher than a predetermined characteristic impedance. In addition, the conductor-missing portions Oa and Ob and the adjustment plates 15 a and 15 b are provided, and hence, the characteristic impedances of the connectors 100 a and 100 b are slightly reduced. As a result, in the high-frequency signal transmission line 10 a, it is possible to match the characteristic impedances of the connectors 100 a and 100 b to the predetermined characteristic impedance with a high degree of accuracy.

In addition, in the high-frequency signal transmission line 10 a, the characteristic impedance of the signal line 20 in the region A1 is higher than the characteristic impedance of the signal line in the region A2. In more detail, as described below, the characteristic impedance of the signal line 20 fluctuates in such a manner that, between the two adjacent bridge portions 60, the characteristic impedance of the signal line 20 decreases from a maximum value Z1 to a minimum value Z2 after increasing from the minimum value Z2 to the maximum value Z1, with coming close from one bridge portion 60 to the other bridge portion 60.

The width of the opening 30 in the y-axis direction is maximized in the center of the region A1 in the x-axis direction, and decreases with coming close to both end portions of the region A1 in the x-axis direction. Therefore, a distance between the signal line 20 and the ground conductor 24 in the region A1 is maximized in the center of the region A1 in the x-axis direction, and decreases with coming close to both end portions of the region A1 in the x-axis direction. As a result, the intensity of a magnetic field occurring in the signal line 20 in the center of the region A1 in the x-axis direction becomes larger than the intensities of magnetic fields occurring in the signal line 20 in both end portions of the region A1 in the x-axis direction. In other words, an inductance component in the center of the region A1 in the x-axis direction becomes large. In other words, an L property becomes dominant in the center of the region A1 in the x-axis direction.

On the other hand, the bridge portion 60 is provided in the region A2. Therefore, a distance between the signal line 20 and the ground conductor 24 in the region A2 is smaller than the distance between the signal line 20 and the ground conductor 24 in the region A1. As a result, in addition to it that capacitance occurring in the signal line 20 in the region A2 becomes larger than capacitance occurring in the signal line 20 in the region A1, a magnetic field intensity in the region A2 becomes smaller than a magnetic field intensity in the region A1. In other words, a C property becomes dominant in the region A2.

As a result of the above, since capacitance rarely occurs between the signal line 20 and the ground conductor 24 in the center of the region A1 in the x-axis direction, the maximum value Z1 occurs due mainly to the inductance of the signal line 20. In addition, in the region A2, since large capacitance has occurred between the signal line 20 and the ground conductor 24, the minimum value Z2 occurs due mainly to the capacitance. As a result, as illustrated in FIG. 11, the characteristic impedance of the signal line 20 periodically fluctuates between the maximum value Z1 and the minimum value Z2. The maximum value Z1 preferably is, for example, about 70Ω. The minimum value Z2 preferably is, for example, about 30Ω. In this regard, however, the characteristic impedance of the signal line 20 in the region A1 and the characteristic impedance in the region A2 are designed so that the characteristic impedance of the whole signal line 20 becomes a predetermined characteristic impedance (for example, about 50Ω).

In addition, according to the high-frequency signal transmission line 10 a, it is possible to reduce a transmission loss associated with the stabilization of a ground potential in the ground conductor 24, and it is possible to improve a shielding characteristic. In more detail, in the high-frequency signal transmission line 10 a, the width of the opening 30 in the center of the region A1 in the x-axis direction is wider than the widths of the opening 30 in both end portions of the region A1 in the x-axis direction. As a result, in the high-frequency signal transmission line 10 a, the magnetic field energy of the signal line 20 located in the center of the region A1 in the x-axis direction becomes higher than the magnetic field energies of the signal line 20 located in both end portions of the region A1 in the x-axis direction. In addition, the magnetic field energy of the signal line 20 located in the region A2 becomes lower than the magnetic field energies of the signal line 20 located in both end portions of the region A1 in the x-axis direction. Accordingly, as illustrated in FIG. 11, the characteristic impedance of the signal line 20 turns out to repeatedly fluctuate in the order of Z2, Z1, Z2, . . . . Accordingly, in the signal line 20, the fluctuation of a magnetic field energy in portions adjacent to each other in the x-axis direction becomes moderate. As a result, a magnetic field energy becomes small in a boundary between the regions A1 and A2, the fluctuation of the ground potential of the ground conductor is significantly reduced or prevented, and the occurrence of unnecessary radiation and the transmission loss of a high-frequency signal is significantly reduced or prevented.

Furthermore, in the high-frequency signal transmission line 10 a, in a case of being disposed in an electronic device such as the electronic device 200 illustrated in FIGS. 5A and 5B, the flat plate-shaped ground conductor 22 is disposed on a battery pack 206 side, compared with the signal line 20. Therefore, it is possible to significantly reduced or prevented electrical interference from the battery pack 206 side to the signal line 20. Accordingly, it is possible to obtain a high-frequency signal transmission line whose transmission loss is small even if a metal member such as the battery pack 206 is near.

Third Preferred Embodiment

Hereinafter, the configuration of a high-frequency signal transmission line according to a third preferred embodiment of the present invention will be described with reference to drawings. FIG. 12 is an exploded view of the dielectric body 12 of a high-frequency signal transmission line 10 b according to the third preferred embodiment. In addition, as for the appearance perspective view of the high-frequency signal transmission line 10 b, FIGS. 1A and 1B are incorporated.

The high-frequency signal transmission line 10 b is different from the high-frequency signal transmission line 10 a mainly in that the ground conductor 24 is not provided. Hereinafter, the high-frequency signal transmission line 10 b will be described in detail with a focus on such a difference.

As illustrated in FIGS. 1A and 1B and FIG. 12, the external terminal 16 a is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 a-b. As illustrated in FIGS. 1A and 1B and FIG. 12, the external terminal 16 b is a rectangular or substantially rectangular conductor provided on the vicinity of the center of the front surface of the connection portion 18 a-c. The external terminals 16 a and 16 b are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper. In addition, the surfaces of the external terminals 16 a and 16 b preferably are gold-plated.

As illustrated in FIG. 12, the signal line 20 is a linear conductor provided within the dielectric body 12 and extends on the front surface of the dielectric sheet 18 b in the x-axis direction. The line width of the signal line 20 remains steady. Both the respective end portions of the signal line 20 overlap with the external terminals 16 a and 16 b in a planar view from the z-axis direction. The signal line 20 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

The via hole conductor b11 penetrates the connection portion 18 a-b of the dielectric sheet 18 a in the z-axis direction, and connects the external terminal 16 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction to each other. The via hole conductor b12 penetrates the connection portion 18 a-c of the dielectric sheet 18 a in the z-axis direction, and connects the external terminal 16 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction to each other. The via hole conductors b11 and b12 are manufactured using metal materials whose specific resistances are small and whose main components are silver or copper.

As illustrated in FIG. 12, the ground conductor 22 (a first ground conductor) is provided within the dielectric body 12 on the positive direction side in the z-axis direction, compared with the signal line 20 (in other words, on the front surface side of the dielectric body 12), and in more detail, provided on the front surface of the dielectric sheet 18 a. The ground conductor 22 extends in the x-axis direction along the signal line 20 on the front surface of the dielectric sheet 18 a, and faces the signal line 20 across the dielectric sheets 18 a and 18 b, as illustrated in FIG. 12.

In addition, the ground conductor 22 includes a main conductor 22 a and terminal conductors 22 b and 22 c. The main conductor 22 a is provided on the front surface of the line portion 18 a-a, and extends in the x-axis direction. In the main conductor 22 a, practically no opening is provided. In other words, the main conductor 22 a is an electrode continuously extending along the signal line 20 in the line portion 12 a in the x-axis direction, namely, a so-called flat plate-shaped electrode. In this regard, however, it is not necessary for the main conductor 22 a to completely cover the line portion 12 a, and for example, a small hole or the like may also be provided in a predetermined position in the main conductor 22 a so as to allow gas to escape, the gas occurring when the thermoplastic resin of the dielectric sheet 18 is subjected to thermocompression bonding. The main conductor 22 a is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

The terminal conductor 22 b is provided on the front surface of the connection portion 18 a-b, and defines a rectangular or substantially rectangular ring surrounding the circumference of the external terminal 16 a. As a result, in the ground conductor 22, a conductor-missing portion Oa is provided in a region surrounded by the terminal conductor 22 b. The external terminal 16 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction are located within the conductor-missing portion Oa in a planar view from the z-axis direction. The terminal conductor 22 b is connected to an end portion of the main conductor 22 a on the negative direction side in the x-axis direction.

The terminal conductor 22 c is provided on the front surface of the connection portion 18 a-c, and has a ring-shaped rectangular or substantially rectangular shape surrounding the circumference of the external terminal 16 b. As a result, in the ground conductor 22, a conductor-missing portion Ob is provided in a region surrounded by the terminal conductor 22 c. The external terminal 16 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction are located within the conductor-missing portion Ob in a planar view from the z-axis direction. The terminal conductor 22 c is connected to an end portion of the main conductor 22 a on the positive direction side in the x-axis direction.

Since a protective layer 14 and adjustment plates 15 a and 15 b in the high-frequency signal transmission line 10 b are the same as the protective layer 14 and the adjustment plates 15 a and 15 b in the high-frequency signal transmission line 10 a, the description thereof will be omitted.

As described above, in the high-frequency signal transmission lines 10 and 10 a, the conductor-missing portions Oa and Ob are provided in the ground conductors 24 and 25 provided on the negative direction side in the z-axis direction, compared with the signal line 20 (in other words, on the back surface side of the dielectric body 12). On the other hand, as illustrated in FIG. 12, in the high-frequency signal transmission line 10 b, the ground conductor 24 or 25 does not exist in which the conductor-missing portions Oa and Ob are provided. Instead, in the high-frequency signal transmission line 10 b, the conductor-missing portions Oa and Ob are provided in the ground conductor 22 provided on the positive direction side in the z-axis direction, compared with the signal line 20 (in other words, on the front surface side of the dielectric body 12). In other words, the ground conductor 22, 24, or 25 in which the conductor-missing portions Oa and Ob are provided may also be provided on the positive direction side in the z-axis direction, compared with the signal line 20, and may also be provided on the negative direction side in the z-axis direction, compared with the signal line 20.

According to the high-frequency signal transmission line 10 b configured in such a way as described above, it is possible to significantly reduce or prevent mismatching of characteristic impedances in the connectors 100 a and 100 b with respect to predetermined characteristic impedances, in the same way as the high-frequency signal transmission line 10 a. In more detail, in the high-frequency signal transmission line 10 b, the adjustment plates 15 a and 15 b are individually provided on the back surface of the dielectric body 12, and overlap with at least portions of the conductor-missing portions Oa and Ob, respectively, in a planar view from the z-axis direction. As a result, capacitances C2 turn out to be generated between the adjustment plates 15 a and 15 b and the end portions of the signal line 20. Furthermore, capacitances C3 turn out to be generated between the adjustment plates 15 a and 15 b and the terminal conductors 22 b and 22 c of the ground conductor 22. In other words, between the signal line 20 and the ground conductor 22, the capacitances C2 are C3 are connected in series, as illustrated in FIG. 7.

Here, when the capacitances C2 and C3 have been connected in series, the combined capacitance Ct of the capacitances C2 and C3 becomes a minute value. Accordingly, the minute combined capacitances Ct are generated in the connectors 100 a and 100 b, and it is possible to slightly reduce the characteristic impedances of the connectors 100 a and 100 b. In other words, it is possible to finely adjust the characteristic impedances of the connectors 100 a and 100 b. As a result, in the high-frequency signal transmission line 10 b, by providing the conductor-missing portions Oa and Ob and the adjustment plates 15 a and 15 b, it is possible to match the characteristic impedances of the connectors 100 a and 100 b to the predetermined characteristic impedances with a high degree of accuracy.

In addition, in the high-frequency signal transmission line 10 b, in the same way as the high-frequency signal transmission line 10 a, the large deformations of the connection portions 12 b and 12 c are significantly reduced or prevented, and the damages of the connection portions 12 b and 12 c are significantly reduced or prevented.

Furthermore, in the high-frequency signal transmission line 10 b, in a case of being disposed in an electronic device such as the electronic device 200 illustrated in FIGS. 5A and 5B, the flat plate-shaped ground conductor 22 is disposed on the battery pack 206 side, compared with the signal line 20. Therefore, it is possible to significantly reduce or prevent electrical interference from the battery pack 206 side to the signal line 20. Accordingly, it is possible to obtain a high-frequency signal transmission line whose transmission loss is small even if a metal member such as the battery pack 206 is near.

First Example of Modification

Hereinafter, a high-frequency signal transmission line according to a first example of a modification of a preferred embodiment of the present invention will be described with reference to drawings. FIGS. 13A and 13B are appearance perspective views of a high-frequency signal transmission line 10 c according to the first example of a modification.

The internal configuration of the high-frequency signal transmission line 10 c preferably is the same as the internal configuration of any one of the high-frequency signal transmission lines 10 and 10 a. The high-frequency signal transmission line 10 c is different from the high-frequency signal transmission lines 10 and 10 a in a method for sticking the adjustment plates 15 a and 15 b. In more detail, in the high-frequency signal transmission lines 10 and 10 a, the adjustment plates 15 a and 15 b are stuck to the dielectric body 12 preferably using an adhesive. In general, the adhesive preferably is a relatively thin layer.

On the other hand, in the high-frequency signal transmission line 10 c, the adjustment plates 15 a and 15 b are stuck to the dielectric body 12 using relatively thick adhesive sheets 40 a and 40 b (adhesives). Accordingly, by adjusting the thicknesses of the adhesive sheets 40 a and 40 b, it is possible to adjust the magnitudes of capacitances between the adjustment plates 15 a and 15 b and the signal line 20 and the magnitudes of capacitances between the adjustment plates 15 a and 15 b and the ground conductors 24 and 25. Accordingly, it is only necessary to design the thicknesses of the adhesive sheets 40 a and 40 b so that the characteristic impedances of the connectors 100 a and 100 b become a predetermined characteristic impedance (e.g., about 50Ω).

Second Example of Modification

Hereinafter, a high-frequency signal transmission line according to a second example of a modification of a preferred embodiment of the present invention will be described with reference to drawings. FIGS. 14A and 14B are appearance perspective views of a high-frequency signal transmission line 10 d according to the second example of a modification.

The internal configuration of the high-frequency signal transmission line 10 d preferably is the same as the internal configuration of any one of the high-frequency signal transmission lines 10 and 10 a. The high-frequency signal transmission line 10 d is different from the high-frequency signal transmission lines 10 and 10 a in the shapes of the adjustment plates 15 a and 15 b. In more detail, in the high-frequency signal transmission lines 10 and 10 a, the adjustment plates 15 a and 15 b preferably have rectangular or substantially rectangular shapes.

On the other hand, in the high-frequency signal transmission line 10 d, holes H1 and H2 and cutouts E1 and E2 are provided in the adjustment plates 15 a and 15 b. In this way, by providing the holes H1 and H2 and the cutouts E1 and E2, it is possible to adjust the magnitudes of capacitances between the adjustment plates 15 a and 15 b and the signal line 20 and the magnitudes of capacitances between the adjustment plates 15 a and 15 b and the ground conductors 24 and 25. Accordingly, it is only necessary to design the shapes of the adjustment plates 15 a and 15 b so that the characteristic impedances of the connectors 100 a and 100 b become a predetermined characteristic impedance (e.g., about 50Ω).

Fourth Preferred Embodiment

Hereinafter, the configuration of a high-frequency signal transmission line 10 e according to a fourth preferred embodiment of the present invention will be described with reference to drawings. FIG. 15 and FIG. 16 are appearance perspective views of the high-frequency signal transmission line 10 e according to the fourth preferred embodiment. FIG. 17 is an exploded perspective view of the dielectric body 12 of the high-frequency signal transmission line 10 e in FIG. 15. In what follows, the lamination direction of the high-frequency signal transmission line 10 e is defined as a z-axis direction. In addition, the longitudinal direction of the high-frequency signal transmission line 10 e is defined as an x-axis direction, and a direction perpendicular to the x-axis direction and the z-axis direction is defined as a y-axis direction.

The high-frequency signal transmission line 10 e is not connected to a circuit substrate through the connectors 100 a and 100 b but connected to a circuit substrate through terminal conductors 22 b, 22 c, 43 a, and 43 b.

The high-frequency signal transmission line 10 e is a flat-cable flexible circuit substrate preferably used to connect two high-frequency circuits within, for example, an electronic device such as a cellular phone. As illustrated in FIG. 15 to FIG. 17, the high-frequency signal transmission line 10 e includes the dielectric body 12, adjustment plates 15 a and 15 b, a signal line 20, ground conductors 22 and 24, terminal conductors 43 a and 43 b, and via hole conductors b11, b12, and B11 to B18.

As illustrated in FIG. 15 and FIG. 16, in a planar view from the z-axis direction, the dielectric body 12 is a plate-shaped member having flexibility and extending in the x-axis direction, and includes a line portion 12 a and connection portions 12 b and 12 c. As illustrated in FIG. 17, the dielectric body 12 is a laminated body including a protective layer 14 and dielectric sheets 18 a to 18 c that are laminated in this order from the positive direction side in the z-axis direction to the negative direction side therein. In what follows, the main surface of the dielectric body 12 on a positive direction side in the z-axis direction is referred to as a front surface, and the main surface of the dielectric body 12 on a negative direction side in the z-axis direction is referred to as a back surface.

As illustrated in FIG. 15 and FIG. 16, the line portion 12 a extends in the x-axis direction. The connection portions 12 b and 12 c are connected to an end portion of the line portion 12 a on a negative direction side in the x-axis direction and an end portion of the line portion 12 a on a positive direction side in the x-axis direction, respectively, and have respective rectangular shapes. The widths of the connection portions 12 b and 12 c in the y-axis direction are larger than the width of the line portion 12 a in the y-axis direction.

As illustrated in FIG. 17, the dielectric sheets 18 a to 18 c extend in the x-axis direction, and preferably have the same or substantially the same shape as the dielectric body 12 in a planar view from the z-axis direction. The dielectric sheets 18 a to 18 c are preferably made of a thermoplastic resin having flexibility, such as polyimide or liquid crystalline polymer. Hereinafter, the main surfaces of the dielectric sheets 18 a to 18 c on the positive direction side in the z-axis direction are referred to as front surfaces, and the main surfaces of the dielectric sheets 18 a to 18 c on the negative direction side in the z-axis direction are referred to as back surfaces.

As illustrated in FIG. 17, the thickness T1 of the dielectric sheet 18 a is larger than the thickness T2 of the dielectric sheet 18 b. After the lamination of the dielectric sheets 18 a to 18 c, the thickness T1 preferably ranges, for example, from about 50 μm to about 300 μm. In the present preferred embodiment, the thickness T1 preferably is about 150 μm, for example. In addition, the thickness T2 preferably ranges, for example, from about 10 μm to about 100 μm, for example. In the present preferred embodiment, the thickness T2 preferably is about 50 μm, for example.

In addition, as illustrated in FIG. 17, the dielectric sheet 18 a includes a line portion 18 a-a and connection portions 18 a-b and 18 a-c. As illustrated in FIG. 17, the dielectric sheet 18 b includes a line portion 18 b-a and connection portions 18 b-b and 18 b-c. The dielectric sheet 18 c includes a line portion 18 c-a and connection portions 18 c-b and 18 c-c. The line portions 18 a-a, 18 b-a, and 18 c-a configure the line portion 12 a. The connection portions 18 a-b, 18 b-b, and 18 c-b define the connection portion 12 b. The connection portions 18 a-c, 18 b-c, and 18 c-c define the connection portion 12 c.

As illustrated in FIG. 17, the signal line 20 is a linear conductor through which a high-frequency signal is transmitted and which is provided within the dielectric body 12. In the present preferred embodiment, the signal line 20 is a linear conductor that is provided on the front surface of the dielectric sheet 18 b and extends in the x-axis direction.

As illustrated in FIG. 17, an end portion of the signal line 20 on the negative direction side in the x-axis direction is located on a negative direction side in the y-axis direction, compared with the center of the connection portion 18 b-b. As illustrated in FIG. 17, an end portion of the signal line 20 on the positive direction side in the x-axis direction is located on the negative direction side in the y-axis direction, compared with the center of the connection portion 18 b-c. The signal line 20 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper. Here, that the signal line 20 is provided on the front surface of the dielectric sheet 18 b indicates that metal foil formed on the front surface of the dielectric sheet 18 b by plating is subjected to patterning and thus the signal line 20 is formed or that metal foil stuck to the front surface of the dielectric sheet 18 b is subjected to patterning and thus the signal line 20 is formed. In addition, since smoothing is performed on the surface of the signal line 20, the surface roughness of a surface in contact with the dielectric sheet 18 b in the signal line 20 becomes larger than the surface roughness of a surface not in contact with the dielectric sheet 18 b in the signal line 20.

As illustrated in FIG. 17, the ground conductor 22 is a flat plate-shaped conductor layer provided on the positive direction side in the z-axis direction, compared with the signal line 20. In more detail, the ground conductor 22 is provided on the front surface of the dielectric sheet 18 a, and faces the signal line 20 across the dielectric sheet 18 a. In the ground conductor 22, no opening is provided in a position in which to overlap with the signal line 20. The ground conductor 22 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

Here, that the ground conductor 22 is provided on the front surface of the dielectric sheet 18 a indicates that metal foil formed on the front surface of the dielectric sheet 18 a by plating is subjected to patterning and thus the ground conductor 22 is formed or that metal foil stuck to the front surface of the dielectric sheet 18 a is subjected to patterning and thus the ground conductor 22 is formed. In addition, since smoothing is performed on the surface of the ground conductor 22, the surface roughness of a surface in contact with the dielectric sheet 18 a in the ground conductor 22 becomes larger than the surface roughness of a surface not in contact with the dielectric sheet 18 a in the ground conductor 22.

In addition, as illustrated in FIG. 17, the ground conductor 22 includes a main conductor 22 a and terminal conductors 22 b and 22 c. The main conductor 22 a is provided on the front surface of the line portion 18 a-a, and extends in the x-axis direction. The terminal conductor 22 b is a rectangular or substantially rectangular conductor provided on the front surface of the connection portion 18 a-b. In more detail, the terminal conductor 22 b extends in the x-axis direction on a positive direction side in the y-axis direction, compared with the center of the connection portion 18 a-b, and functions as an external electrode. The terminal conductor 22 b is connected to an end portion of the main conductor 22 a on the negative direction side in the x-axis direction.

The terminal conductor 22 c is a rectangular or substantially rectangular conductor provided on the front surface of the connection portion 18 a-c. In more detail, the terminal conductor 22 c extends in the x-axis direction on the positive direction side in the y-axis direction, compared with the center of the connection portion 18 a-c, and functions as an external electrode. The terminal conductor 22 c is connected to an end portion of the main conductor 22 a on the positive direction side in the x-axis direction.

Here, the characteristic impedance of the high-frequency signal transmission line 10 e is defined mainly on the basis of a facing area and a distance between the signal line 20 and the ground conductor 22 and the relative permittivities of the dielectric sheets 18 a to 18 c. Therefore, in a case where the characteristic impedance of the high-frequency signal transmission line 10 e is set to 50Ω, designing is performed, for example, so that the characteristic impedance of the high-frequency signal transmission line 10 e becomes 55Ω, for example, because of the signal line 20 and the ground conductor 22, the 55Ω being slightly higher than 50Ω. In addition, the shape of the ground conductor 24 is adjusted so that the characteristic impedance of the high-frequency signal transmission line 10 e becomes 50Ω because of the signal line 20, the ground conductor 22, and the ground conductor 24. As described above, the ground conductor 22 functions as a reference-ground electrode.

As illustrated in FIG. 17, the ground conductor 24 is a conductor layer provided on the negative direction side in the z-axis direction, compared with the signal line 20. In more detail, the ground conductor 24 is provided on the front surface of the dielectric sheet 18 c, and faces the signal line 20 across the dielectric sheet 18 b. The ground conductor 24 is manufactured using a metal material whose specific resistance is small and whose main component is silver or copper.

Here, that the ground conductor 24 is provided on the front surface of the dielectric sheet 18 c indicates that metal foil formed on the front surface of the dielectric sheet 18 c by plating is subjected to patterning and thus the ground conductor 24 is formed or that metal foil stuck to the front surface of the dielectric sheet 18 c is subjected to patterning and thus the ground conductor 24 is formed. In addition, since smoothing is performed on the surface of the ground conductor 24, the surface roughness of a surface in contact with the dielectric sheet 18 c in the ground conductor 24 becomes larger than the surface roughness of a surface not in contact with the dielectric sheet 18 c in the ground conductor 24.

In addition, as illustrated in FIG. 17, the ground conductor 24 includes a main conductor 24 a and terminal conductors 24 b and 24 c. The main conductor 24 a is provided on the front surface of the line portion 18 c-a, and extends in the x-axis direction. The terminal conductor 24 b is provided on the front surface of the connection portion 18 c-b, and preferably has a rectangular or substantially rectangular shape. The terminal conductor 24 b is connected to an end portion of the main conductor 24 a on the negative direction side in the x-axis direction. In this regard, however, in the terminal conductor 24 b, a rectangular or substantially rectangular conductor-missing portion Oa is provided. In a planar view from the z-axis direction, the conductor-missing portion Oa overlaps with an end portion of the signal line 20 on the negative direction side in the x-axis direction. The terminal conductor 24 c is provided on the front surface of the connection portion 18 c-c, and has a rectangular shape. The terminal conductor 24 c is connected to an end portion of the main conductor 24 a on the positive direction side in the x-axis direction. In this regard, however, in the terminal conductor 24 c, a rectangular or substantially rectangular conductor-missing portion Ob is provided. In a planar view from the z-axis direction, the conductor-missing portion Ob overlaps with an end portion of the signal line 20 on the positive direction side in the x-axis direction.

In addition, as illustrated in FIG. 17, in the main conductor 24 a, a plurality of openings 30 are provided that are arranged in the x-axis direction and have rectangular or substantially rectangular shapes. As a result, the main conductor 24 a has a ladder shape. In addition, in the ground conductor 24, a portion sandwiched between the openings 30 adjacent to each other is referred to as a bridge portion 60. The bridge portion 60 extends in the y-axis direction. In a planar view from the z-axis direction, the plural openings 30 and the plural bridge portions 60 alternately overlap with the signal line 20. In addition, in the present preferred embodiment, the signal line 20 passes over, in the x-axis direction, the centers of the openings 30 and the bridge portions 60 in the y-axis direction.

The ground conductor 24 is an auxiliary ground conductor also functioning as a shield. In addition, as described above, the ground conductor 24 is designed in order to make a final adjustment so that the characteristic impedance of the high-frequency signal transmission line 10 e becomes 50Ω, for example. Specifically, the size of the opening 30, the line width of the bridge portion 60, and so forth are designed.

As described above, no opening is provided in the ground conductor 22, and the opening 30 is provided in the ground conductor 24. Accordingly, an area where the ground conductor 24 and the signal line 20 face each other is smaller than an area where the ground conductor 22 and the signal line 20 face each other.

The terminal conductor 43 a is a rectangular or substantially rectangular conductor provided on the front surface of the connection portion 18 a-b, and functions as an external electrode. In more detail, the terminal conductor 43 a extends in the x-axis direction, on the negative direction side in the y-axis direction, compared with the center of the connection portion 18 a-b. In addition, in a planar view from the z-axis direction, an end portion of the terminal conductor 43 a on the positive direction side in the x-axis direction overlaps with an end portion of the signal line 20 on the negative direction side in the x-axis direction.

The terminal conductor 43 b is a rectangular or substantially rectangular conductor provided on the front surface of the connection portion 18 a-c, and functions as an external electrode. In more detail, the terminal conductor 43 b extends in the x-axis direction, on the negative direction side in the y-axis direction, compared with the center of the connection portion 18 a-c. In addition, in a planar view from the z-axis direction, an end portion of the terminal conductor 43 b on the negative direction side in the x-axis direction overlaps with an end portion of the signal line 20 on the positive direction side in the x-axis direction.

The signal line 20, the ground conductors 22 and 24, and the terminal conductors 43 a and 43 b have approximately the same thicknesses. The thicknesses of the signal line 20, the ground conductors 22 and 24, and the terminal conductors 43 a and 43 b preferably range, for example, from about 10 μm to about 20 μm.

As described above, the signal line 20 is sandwiched from both sides thereof in the z-axis direction, by the ground conductor 22 and the ground conductor 24. In other words, the signal line 20, the ground conductor 22, and the ground conductor 24 define a triplate-type strip line structure. In addition, as illustrated in FIG. 17, an interval (a distance in the z-axis direction) between the signal line 20 and the ground conductor 22 is approximately equal to the thickness T1 of the dielectric sheet 18 a, and preferably ranges, for example, from about 50 μm to about 300 μm. In the present preferred embodiment, the interval between the signal line 20 and the ground conductor 22 preferably is about 150 μm, for example. In addition, as illustrated in FIG. 17, an interval (a distance in the z-axis direction) between the signal line 20 and the ground conductor 24 is approximately equal to the thickness T2 of the dielectric sheet 18 b, and preferably ranges, for example, from about 10 μm to about 100 μm. In the present preferred embodiment, the interval between the signal line 20 and the ground conductor 24 preferably is about 50 μm, for example. Accordingly, the distance between the signal line 20 and the ground conductor 24 in the z-axis direction is smaller than the distance between the signal line 20 and the ground conductor 22 in the z-axis direction.

As illustrated in FIG. 17, the plural via hole conductors B11 penetrate the dielectric sheet 18 a in the z-axis direction, on the positive direction side in the y-axis direction compared with the signal line 20, and are laid out in a line in the x-axis direction at equal intervals. As illustrated in FIG. 17, the plural via hole conductors B12 penetrate the dielectric sheet 18 b in the z-axis direction, on the positive direction side in the y-axis direction compared with the signal line 20, and are laid out in a line in the x-axis direction at equal intervals. The via hole conductors B11 and B12 configure one via hole conductor by being connected to each other. In addition, an end portion of the via hole conductor B11 on the positive direction side in the z-axis direction is connected to the ground conductor 22. An end portion of the via hole conductor B12 on the negative direction side in the z-axis direction is connected to the ground conductor 24, and, in more detail, connected to the ground conductor 24 on the positive direction side in the y-axis direction, compared with the bridge portion 60. Via holes formed in the dielectric sheets 18 a and 18 b have been filled with a conductive paste whose main component is silver, tin, copper, or the like, the conductive paste has been solidified, and hence the via hole conductors B11 and B12 are formed.

As illustrated in FIG. 17, the plural via hole conductors B13 penetrate the dielectric sheet 18 a in the z-axis direction, on the negative direction side in the y-axis direction compared with the signal line 20, and are laid out in a line in the x-axis direction at equal intervals. As illustrated in FIG. 17, the plural via hole conductors B14 penetrate the dielectric sheet 18 b in the z-axis direction, on the negative direction side in the y-axis direction compared with the signal line 20, and are laid out in a line in the x-axis direction at equal intervals. The via hole conductors B13 and B14 configure one via hole conductor by being connected to each other. In addition, an end portion of the via hole conductor B13 on the positive direction side in the z-axis direction is connected to the ground conductor 22. An end portion of the via hole conductor B14 on the negative direction side in the z-axis direction is connected to the ground conductor 24, and, in more detail, connected to the ground conductor 24 on the negative direction side in the y-axis direction, compared with the bridge portion 60. Via holes formed in the dielectric sheets 18 a and 18 b have been filled with a conductive paste whose main component is silver, tin, copper, or the like, the conductive paste has been solidified, and hence the via hole conductors B13 and B14 are formed.

As illustrated in FIG. 17, the via hole conductor B15 penetrates the connection portion 18 a-b of the dielectric sheet 18 a in the z-axis direction. As illustrated in FIG. 17, the via hole conductor B16 penetrates the connection portion 18 b-b of the dielectric sheet 18 b in the z-axis direction. The via hole conductors B15 and B16 define one via hole conductor by being connected to each other. In addition, an end portion of the via hole conductor B15 on the positive direction side in the z-axis direction is connected to the terminal conductor 22 b of the ground conductor 22. An end portion of the via hole conductor B16 on the negative direction side in the z-axis direction is connected to the terminal conductor 24 b of the ground conductor 24. Via holes formed in the dielectric sheets 18 a and 18 b have been filled with a conductive paste whose main component is silver, tin, copper, or the like, the conductive paste has been solidified, and hence the via hole conductors B15 and B16 are formed.

As illustrated in FIG. 17, the via hole conductor B17 penetrates the connection portion 18 a-c of the dielectric sheet 18 a in the z-axis direction. As illustrated in FIG. 17, the via hole conductor B18 penetrates the connection portion 18 b-c of the dielectric sheet 18 b in the z-axis direction. The via hole conductors B17 and B18 define one via hole conductor by being connected to each other. In addition, an end portion of the via hole conductor B17 on the positive direction side in the z-axis direction is connected to the terminal conductor 22 c of the ground conductor 22. An end portion of the via hole conductor B18 on the negative direction side in the z-axis direction is connected to the terminal conductor 24 c of the ground conductor 24. Via holes formed in the dielectric sheets 18 a and 18 b have been filled with a conductive paste whose main component is silver, tin, copper, or the like, the conductive paste has been solidified, and hence the via hole conductors B17 and B18 are formed.

As illustrated in FIG. 17, the via hole conductor b11 penetrates the connection portion 18 a-b of the dielectric sheet 18 a in the z-axis direction, and connects the terminal conductor 43 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction to each other. As illustrated in FIG. 17, the via hole conductor b12 penetrates the connection portion 18 a-c of the dielectric sheet 18 a in the z-axis direction, and connects the terminal conductor 43 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction to each other. As a result, the signal line 20 is connected between the terminal conductors 43 a and 43 b. Via holes formed in the dielectric sheets 18 a and 18 b have been filled with a conductive paste whose main component is silver, tin, copper, or the like, the conductive paste has been solidified, and hence the via hole conductors b11 and b12 are formed.

The protective layer 14 is insulation film provided on the front surface of the dielectric sheet 18 a, and covers substantially the entire surface of the front surface of the dielectric sheet 18 a. As a result, the protective layer 14 covers the ground conductor 22. The protective layer 14 is made of, for example, a flexible resin such as a resist material.

In addition, as illustrated in FIG. 17, the protective layer 14 includes a line portion 14 a and connection portions 14 b and 14 c. The line portion 14 a covers the main conductor 22 a by covering the entire surface of the front surface of the line portion 18 a-a.

The connection portion 14 b is connected to an end portion of the line portion 14 a on the negative direction side in the x-axis direction, and covers a portion of the front surface of the connection portion 18 a-b. In this regard, however, as illustrated in FIG. 15, the connection portion 14 b does not cover the terminal conductors 22 b and 43 a.

The connection portion 14 c is connected to an end portion of the line portion 14 a on the positive direction side in the x-axis direction, and covers a portion of the front surface of the connection portion 18 a-c. In this regard, however, as illustrated in FIG. 15, the connection portion 14 c does not cover the terminal conductors 22 c and 43 b.

The adjustment plate 15 a is provided on the back surface of the connection portion 12 b of the dielectric body 12 (in other words, the back surface of the connection portion 18 c-b of the dielectric sheet 18 c), and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Oa in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 a is not electrically connected to any one of the signal line 20 and the ground conductors 22 and 24, and is maintained at a floating potential. In more detail, the adjustment plate 15 a overlaps with the whole of the conductor-missing portion Oa in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the negative direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 a and an end portion of the signal line 20 on the negative direction side in the x-axis direction. Furthermore, the adjustment plate 15 a protrudes out of the conductor-missing portion Oa, and hence, overlaps with the terminal conductor 24 b of the ground conductor 24 in a planar view from the z-axis direction. As a result, capacitance is generated between the adjustment plate 15 a and the terminal conductor 24 b of the ground conductor 24.

The adjustment plate 15 b is provided on the back surface of the connection portion 12 c of the dielectric body 12 (in other words, the back surface of the connection portion 18 c-c of the dielectric sheet 18 c), and a rectangular or substantially rectangular metal plate overlapping with at least a portion of the conductor-missing portion Ob in a planar view from the z-axis direction. Furthermore, the adjustment plate 15 b is not electrically connected to any one of the signal line 20 and the ground conductors 22 and 24, and is maintained at a floating potential. In more detail, the adjustment plate 15 b overlaps with the whole of the conductor-missing portion Ob in a planar view from the z-axis direction, and hence, overlaps with an end portion of the signal line 20 on the positive direction side in the x-axis direction. As a result, capacitance is generated between the adjustment plate 15 b and an end portion of the signal line 20 on the positive direction side in the x-axis direction. Furthermore, the adjustment plate 15 b protrudes out of the conductor-missing portion Ob, and hence, overlaps with the terminal conductor 24 c of the ground conductor 24 in a planar view from the z-axis direction. As a result, capacitance is generated between the adjustment plate 15 b and the terminal conductor 24 c of the ground conductor 24. The adjustment plates 15 a and 15 b are defined by, for example, copper plates or SUS plates.

Next, a connection structure between the high-frequency signal transmission line 10 e and a circuit substrate will be described with reference to drawings. FIG. 18 is a perspective view of a connection portion between the high-frequency signal transmission line 10 e and a circuit substrate 202 b. FIG. 19 is a cross-sectional structural view of the connection portion between the high-frequency signal transmission line 10 e and the circuit substrate 202 b. In addition, a connection structure between the high-frequency signal transmission line 10 e and a circuit substrate 202 a and a connection structure between the high-frequency signal transmission line 10 e and the circuit substrate 202 b are equal to each other. Therefore, hereinafter, the connection structure between the high-frequency signal transmission line 10 e and the circuit substrate 202 b will be described.

As illustrated in FIG. 18, the circuit substrate 202 b includes a substrate body 207, external terminals 208 b and 208 c, and a resist 209. The substrate body 207 embeds therein a feed circuit and so forth. The external terminals 208 b and 208 c are provided on the main surface of the substrate body 207 on the negative direction side in the z-axis direction, and arranged in this order from the positive direction side to the negative direction side in the y-axis direction. The external terminals 208 b and 208 c have rectangular or substantially rectangular shapes, and are manufactured using, for example, copper or the like. In a planar view from the z-axis, the direction resist 209 surrounds the circumferences of the external terminals 208 b and 208 c. As a result, the resist 209 also serves a function for the positioning of the high-frequency signal transmission line 10 e. As illustrated in FIG. 19, the external terminals 208 b and 208 c are connected to the terminal conductors 22 c and 43 b, respectively, by a solder.

According to the high-frequency signal transmission line 10 e configured in such a way as described above, it is possible to significantly reduce or prevent mismatching of the characteristic impedances of both end portions of the signal line 20 with respect to predetermined characteristic impedances. FIG. 20 is a cross-sectional structural view of the high-frequency signal transmission line 10 e taken along a line XX-XX in FIG. 17.

In the high-frequency signal transmission line 10 e, the adjustment plates 15 a and 15 b are individually provided on the back surface of the dielectric body 12, and overlap with at least portions of the conductor-missing portions Oa and Ob, respectively, in a planar view from the z-axis direction. As a result, as illustrated in FIG. 20, capacitances C2 turn out to be generated between the adjustment plates 15 a and 15 b and the end portions of the signal line 20. Furthermore, capacitances C3 turn out to be generated between the adjustment plates 15 a and 15 b and the terminal conductors 24 b and 24 c of the ground conductor 24. In other words, between the signal line 20 and the ground conductor 24, the capacitances C2 are C3 are connected in series, as illustrated in FIG. 20.

Here, when the capacitances C2 and C3 have been connected in series, the combined capacitance Ct of the capacitances C2 and C3 becomes a minute value. Accordingly, the minute combined capacitances Ct are generated in the end portions of the signal line 20, and it is possible to slightly reduce the characteristic impedances of the end portions of the signal line 20. In other words, it is possible to finely adjust the characteristic impedances of the end portions of the signal line 20. As a result, in the high-frequency signal transmission line 10 e, by providing the conductor-missing portions Oa and Ob and the adjustment plates 15 a and 15 b, it is possible to match the characteristic impedances of the end portions of the signal line 20 to the predetermined characteristic impedances with a high degree of accuracy.

In addition, the terminal conductors 22 c and 43 b may also be connected to the external terminals 208 b and 208 c by welding, for example.

In addition, stainless-steel metal plates may also be provided above the terminal conductors 22 b, 22 c, 43 a, and 43 b. As a result, the deformations of the connection portions 12 b and 12 c are significantly reduced or prevented. In addition, since the material of the stainless-steel metal plate is different from the materials of the terminal conductors 22 b, 22 c, 43 a, and 43 b, the characteristic impedance of the metal plate is different from the characteristic impedances of the terminal conductors 22 b, 22 c, 43 a, and 43 b. Accordingly, the characteristic impedance of the metal plate is easily mismatched with respect to a predetermined characteristic impedance. Therefore, in a case where the metal plate is applied to the high-frequency signal transmission line 10 e, it is only necessary to adjust the characteristic impedance of the metal plate because of the adjustment plates 15 a and 15 b.

Another Preferred Embodiment

A high-frequency signal transmission line according to the present invention is not limited to the high-frequency signal transmission lines 10 and 10 a to 10 e according to the above-mentioned preferred embodiments, and may be modified within the scope thereof.

In addition, the adjustment plates 15 a and 15 b may also be stuck to the dielectric body 12, using, for example, a resist material.

In addition, while it has been assumed that the adjustment plates 15 a and 15 b preferably are metal plates, the adjustment plates 15 a and 15 b may also be insulating substrates such as glass epoxy resins, in which, for example, conductor layers are provided. In this case, since it is possible to process the conductor layer by etching, it is possible to process the conductor layer with a high degree of accuracy. Accordingly, it is possible to match the characteristic impedances of the connectors 100 a and 100 b to predetermined characteristic impedances with a high degree of accuracy.

In addition, in the high-frequency signal transmission line 10 a, the opening 30 may not exist in the ground conductor 24. In addition, the plural openings 30 may be provided not in the ground conductor 24 but in the ground conductor 22. Furthermore, the plural openings 30 may be provided in each of the ground conductors 22 and 24.

In addition, the configurations illustrated in the high-frequency signal transmission lines 10 and 10 a to 10 e may also be combined.

In addition, it is not necessary for the signal line 20 and the adjustment plates 15 a and 15 b to overlap with each other in a planar view. In this case, the capacitances C2 also occur between the signal line 20 and the adjustment plates 15 a and 15 b through the conductor-missing portions Oa and Ob. In the same way, it is not necessary for the ground conductors 22, 24, and 25 and the adjustment plates 15 a and 15 b to overlap with each other in a planar view.

In addition, the connectors 100 a and 100 b may also be provided on the respective different main surfaces of the dielectric body 12.

In addition, the high-frequency signal transmission lines 10 and 10 a to 10 e may also be used as high-frequency signal transmission lines in RF circuit substrates such as antenna front-end modules.

As described above, preferred embodiments of the present invention are useful for a high-frequency signal transmission line and an electronic device, and in particular, is superior in terms of significantly reducing or preventing mismatching of a characteristic impedance in a connector with respect to a predetermined characteristic impedance.

While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. 

1. (canceled)
 2. A high-frequency signal transmission line comprising: a body including a plurality of insulator layers laminated on each other; a linear signal line provided in or on the body; a first ground conductor facing the signal line across the insulator layer; and an adjustment conductor; wherein the body includes a connection portion in which the signal line and an external circuit are electrically connected in a first main surface; in the first ground conductor, a conductor-missing portion is provided in at least a portion of a region overlapping with the signal line, in a planar view from a lamination direction in the connection portion; and the adjustment conductor is provided in a second main surface of the body, and overlaps with at least a portion of the conductor-missing portion in the planar view from the lamination direction.
 3. The high-frequency signal transmission line according to claim 2, wherein a portion of the adjustment conductor overlaps with the signal line in the planar view of the body from the lamination direction.
 4. The high-frequency signal transmission line according to claim 2, wherein the adjustment conductor includes an insulating substrate in which a metal plate or a conductor layer is provided.
 5. The high-frequency signal transmission line according to claim 2, wherein the adjustment conductor is fixed to the body via an adhesive or a resist material.
 6. The high-frequency signal transmission line according to claim 2, wherein the adjustment conductor is not electrically connected to the signal line or the first ground conductor.
 7. The high-frequency signal transmission line according to claim 2, further comprising: a second ground conductor provided on the first main surface side of the body, compared with the signal line, and facing the signal line across the insulator layer; wherein the first ground conductor is provided on the second main surface side of the body, compared with the signal line; and a plurality of openings are provided in at least one of the first ground conductor and the second ground conductor, the plurality of openings being arranged along the signal line in the planar view from the lamination direction.
 8. The high-frequency signal transmission line according to claim 7, wherein a characteristic impedance of the signal line in a first region overlapping with the openings is higher than a characteristic impedance of the signal line in a second region not overlapping with the openings; and the characteristic impedance of the signal line in the first region and the characteristic impedance of the signal line in the second region are set so that a characteristic impedance of an entirety of the signal line is a predetermined characteristic impedance.
 9. The high-frequency signal transmission line according to claim 2, wherein the first ground conductor is provided on the first main surface side of the body, compared with the signal line.
 10. The high-frequency signal transmission line according to claim 2, further comprising: a connector is mounted on the first main surface of the connection portion of the body, and is electrically connected to the signal line; wherein the signal line is electrically connected to the external circuit through the connector.
 11. The high-frequency signal transmission line according to claim 10, wherein the adjustment conductor is configured such that a characteristic impedance of the connector has a predetermined characteristic impedance.
 12. The high-frequency signal transmission line according to claim 2, further comprising: an external electrode provided on the first main surface of the connection portion of the body and electrically connected to the signal line; wherein the signal line is electrically connected to the external circuit through the external electrode.
 13. The high-frequency signal transmission line according to claim 2, wherein capacitance is generated between the adjustment conductor and the signal line and capacitance is generated between the adjustment conductor and the first ground conductor.
 14. An electronic device comprising: a high-frequency signal transmission line; and a housing containing the high-frequency signal transmission line; wherein the high-frequency signal transmission line includes: a body including a plurality of insulator layers laminated on each other; a linear signal line provided in or on the body; a first ground conductor facing the signal line across the insulator layer; and an adjustment conductor; wherein the body includes a connection portion in which the signal line and an external circuit are electrically connected in a first main surface; in the first ground conductor, a conductor-missing portion is provided in at least a portion of a region overlapping with the signal line, in a planar view from a lamination direction in the connection portion; and the adjustment conductor is provided in a second main surface of the body, and overlaps with at least a portion of the conductor-missing portion in the planar view from the lamination direction.
 15. The electronic device according to claim 14, wherein a portion of the adjustment conductor overlaps with the signal line in the planar view of the body from the lamination direction.
 16. The electronic device according to claim 14, wherein the adjustment conductor includes an insulating substrate in which a metal plate or a conductor layer is provided.
 17. The electronic device according to claim 14, wherein the adjustment conductor is fixed to the body via an adhesive or a resist material.
 18. The electronic device according to claim 14, wherein the adjustment conductor is not electrically connected to the signal line or the first ground conductor.
 19. The electronic device according to claim 14, further comprising: a second ground conductor provided on the first main surface side of the body, compared with the signal line, and facing the signal line across the insulator layer; wherein the first ground conductor is provided on the second main surface side of the body, compared with the signal line; and a plurality of openings are provided in at least one of the first ground conductor and the second ground conductor, the plurality of openings being arranged along the signal line in the planar view from the lamination direction.
 20. The electronic device according to claim 19, wherein a characteristic impedance of the signal line in a first region overlapping with the openings is higher than a characteristic impedance of the signal line in a second region not overlapping with the openings; and the characteristic impedance of the signal line in the first region and the characteristic impedance of the signal line in the second region are set so that a characteristic impedance of an entirety of the signal line is a predetermined characteristic impedance.
 21. The electronic device according to claim 14, wherein the first ground conductor is provided on the first main surface side of the body, compared with the signal line. 